Vibration Analysis for Electronic Equipment,9780471376859

Vibration Analysis for Electronic Equipment

by
Edition: 3rd
ISBN13: 9780471376859
ISBN10: 047137685X
Format: Hardcover
Pub. Date: 2000-07-11
Publisher(s): Wiley-Interscience
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Summary

This book deals with the analysis of various types of vibration environments that can lead to the failure of electronic systems or components.

Author Biography

Dave S. Steinberg is the author of Vibration Analysis for Electronic Equipment, 3rd Edition, published by Wiley.

Table of Contents

Preface xvii
List of Symbols
xix
Introduction
1(16)
Vibration Sources
1(1)
Definitions
2(1)
Vibration Representation
3(1)
Degrees of Freedom
3(2)
Vibration Modes
5(1)
Vibration Nodes
5(1)
Coupled Modes
6(1)
Fasteners
7(3)
Electronic Equipment for Airplanes and Missiles
10(3)
Electronic Equipment for Ship and Submarines
13(2)
Electronic Equipment for Automobiles, Trucks, and Trains
15(1)
Electronics for Oil Drilling Equipment
16(1)
Electronics for Computers, Communication, and Entertainment
16(1)
Vibrations of Simple Electronic Systems
17(22)
Single Spring-Mass System Without Damping
17(4)
Sample Problem---Natural Frequency of a Cantilever Beam
19(2)
Single-Degree-of-Freedom Torsional Systems
21(2)
Sample Problem---Natural Frequency of a Torsion System
22(1)
Springs in Series and Parallel
23(3)
Sample Problem---Resonant Frequency of a Spring System
25(1)
Relation of Frequency and Acceleration to Displacement
26(4)
Sample Problem---Natural Frequency and Stress in a Beam
27(3)
Forced Vibrations with Viscous Damping
30(4)
Transmissibility as a Function of Frequency
34(2)
Sample Problem---Relating the Resonant Frequency to the Dynamic Displacement
34(2)
Multiple Spring---Mass Systems Without Damping
36(3)
Sample Problem---Resonant Frequency of a System
37(2)
Component Lead Wire and Solder Joint Vibration Fatigue Life
39(17)
Introduction
39(1)
Vibration Problems with Components Mounted High Above the PCB
39(4)
Sample Problem---Vibration Fatigue Life in the Wires of a TO-5 Transistor
40(3)
Vibration Fatigue Life in Solder Joints of a TO-5 Transistor
43(2)
Recommendations to Fix the Wire Vibration Problem
45(1)
Dynamic Forces Developed in Transformer Wires During Vibration
46(3)
Sample Problem---Dynamic Forces and Fatigue Life in Transformer Lead Wires
46(3)
Relative Displacements Between PCB and Component Produce Lead Wire Strain
49(7)
Sample Problem---Effects of PCB Displacement on Hybrid Reliability
50(6)
Beam Structures for Electronic Subassemblies
56(19)
Natural Frequency of a Uniform Beam
56(8)
Sample Problem---Natural Frequencies of Beams
60(4)
Nonuniform Cross Sections
64(5)
Sample Problem---Natural Frequency of a Box with Nonuniform Sections
68(1)
Composite Beams
69(6)
Component Lead Wires as Bents, Frames, and Arcs
75(28)
Electronic Components Mounted on Circuit Boards
75(2)
Bent with a Lateral Load---Hinged Ends
77(3)
Strain Energy---Bent with Hinged Ends
80(3)
Strain Energy---Bent with Fixed Ends
83(7)
Strain Energy---Cricular Arc with Hinged Ends
90(2)
Strain Energy---Circular Arc with Fixed Ends
92(2)
Strain Energy---Circular Arcs for Lead Wire Strain Relief
94(9)
Sample Problem---Adding an Offset in a Wire to Increase the Fatigue Life
97(6)
Printed Circuit Boards and Flat Plates
103(47)
Various Types of Printed Circuit Boards
103(3)
Changes in Circuit Board Edge Conditions
106(2)
Estimating the Transmissibility of a Printed Circuit Board
108(3)
Natural Frequency Using a Trigonometric Series
111(5)
Natural Frequency Using a Polynomial Series
116(6)
Sample Problem---Resonant Frequency of a PCB
120(2)
Natural Frequency Equations Derived Using the Rayleigh Method
122(5)
Dynamic Stresses in the Circuit Board
127(5)
Sample Problem---Vibration Stresses in a PCB
131(1)
Ribs on Printed Circuit Boards
132(5)
Ribs Fastened to Circuit Boards with Screws
137(4)
Printed Circuit Boards With Ribs in Two Directions
141(1)
Proper Use of Ribs to Stiffen Plates and Circuit Boards
141(1)
Quick Way to Estimate the Required Rib Spacing for Circuit Boards
142(2)
Natural Frequencies for Different PCB Shapes with Different Supports
144(6)
Sample Problem---Natural Frequency of a Triangular PCB with Three Point Supports
149(1)
Octave Rule, Snubbing, and Damping to Increase the PCB Fatigue Life
150(16)
Dynamic Coupling Between the PCBs and Their Support Structures
150(4)
Effects of Loose Edge Guides on Plug-in Type PCBs
154(1)
Description of Dynamic Computer Study for the Octave Rule
154(1)
The Forward Octave Rule Always Works
155(1)
The Reverse Octave Rule Must Have Lightweight PCBs
155(2)
Sample Problem---Vibration Problems with Relays Mounted on PCBs
156(1)
Proposed Corrective Action for Relays
157(2)
Using Snubbers to Reduce PCB Displacements and Stresses
159(3)
Sample Problem---Adding Snubbers to Improve PCB Reliability
161(1)
Controlling the PCB Transmissibility with Damping
162(1)
Properties of Material Damping
162(1)
Constrained Layer Damping with Viscoelastic Materials
163(1)
Why Stiffening Ribs on PCBs are Often Better than Damping
164(1)
Problems with PCB Viscoelastic Dampers
164(2)
Preventing Sinusoidal Vibration Failures in Electronic Equipment
166(22)
Introduction
166(1)
Estimating the Vibration Fatigue Life
167(2)
Sample Problem---Qualification Test for an Electronic System
168(1)
Electronic Component Lead Wire Strain Relief
169(2)
Designing PCBs for Sinusoidal Vibration Environments
171(4)
Sample Problem---Determining Desired PCB Resonant Frequency
174(1)
How Location and Orientation of Component on PCB Affect Life
175(2)
How Wedge Clamps Affect the PCB Resonant Frequency
177(5)
Sample Problem---Resonant Frequency of PCB with Side Wedge Clamps
179(3)
Effects of Loose PCB Side Edge Guides
182(3)
Sample Problem---Resonant Frequency of PCB with Loose Edge Guides
185(1)
Sine Sweep Through a Resonance
185(3)
Sample Problem---Fatigue Cycles Accumulated During a Sine Sweep
187(1)
Designing Electronics for Random Vibration
188(46)
Introduction
188(1)
Basic Failure Modes in Random Vibration
188(1)
Characteristics of Random Vibration
189(1)
Differences Between Sinusoidal and Random Vibrations
190(2)
Random Vabration Input Curves
192(1)
Sample Problem---Determining the Input RMS Acceleration Level
193(1)
Random Vibration Units
193(1)
Shaped Random Vibration Input Curves
194(3)
Sample Problem---Input RMS Accelerations for Sloped PSD Curves
195(2)
Relation Between Decibels and Slope
197(1)
Integration Method for Obtaining the Area Under a PSD Curve
198(2)
Finding Points on the PSD Curve
200(1)
Sample Problem---Finding PSD Values
200(1)
Using Basic Logarithms to Find Points on the PSD Curve
201(1)
Probability Distribution Functions
202(1)
Gaussian or Normal Distribution Curve
202(2)
Correlating Random Vibration Failures Using the Three-Band Technique
204(1)
Rayleigh Distribution Function
205(1)
Response of a Single-Degree-of-Freedom System to Random Vibration
206(8)
Sample Problem---Estimating the Random Vibration Fatigue Life
208(6)
How PCBs Respond to Random Vibration
214(1)
Designing PCBs for Random Vibration Environments
215(5)
Sample Problem---Finding the Desired PCB Resonant Frequency
218(2)
Effects of Relative Motion on Component Fatigue Life
220(2)
Sample Problem---Component Fatigue Life
221(1)
It's the Input PSD that Counts, Not the Input RMS Acceleration
222(1)
Connector Wear and Surface Fretting Corrosion
223(1)
Sample Problem---Determining Approximate Connector Fatigue Life
224(1)
Multiple-Degree-of-Freedom System
224(1)
Octave Rule for Random Vibration
225(6)
Sample Problem---Response of Chassis and PCB to Random Vibration
226(3)
Sample Problem---Dynamic Analysis of an Electronic Chassis
229(2)
Determining the Number of Positive Zero Crossings
231(3)
Sample Problem---Determining the Number of Positive Zero Crossings
233(1)
Acoustic Noise Effects on Electronics
234(14)
Introduction
234(1)
Sample Problem---Determining the Sound Pressure Level
234(1)
Microphonic Effects in Electronic Equipment
235(1)
Methods for Generating Acoustic Noise Tests
236(2)
One-Third Octave Bandwidth
238(1)
Determining the Sound Pressure Spectral Density
238(1)
Sound Pressure Response to Acoustic Noise Excitation
239(6)
Sample Problem---Fatigue Life of a Sheet-Metal Panel Exposed to Acoustic Noise
240(5)
Determining the Acceleration Spectral Density
245(3)
Sample Problem---Alternate Method of Acoustic Noise Analysis
246(2)
Designing Electronics for Shock Environments
248(52)
Introduction
248(1)
Specifying the Shock Environment
249(2)
Pulse Shock
251(1)
Half-Sine Shock Pulse for Zero Rebound and Full Rebound
252(5)
Sample Problem---Half-Sine Shock-Pulse Drop Test
253(4)
Response of Electronic Structures to Shock Pulses
257(1)
Respoinse of a Simple System to Various Shock Pulses
258(2)
How PCBs Respond to Shock Pulses
260(1)
Determining the Desired PCB Resonant Frequency for Shock
260(4)
Sample Problem---Response of a PCB to a Half-Sine Shock Pulse
262(2)
Response of PCB to Other Shock Pulses
264(5)
Sample Problem---Shock Response of a Transformer Mounting Bracket
265(4)
Equivalent Shock Pulse
269(5)
Sample Problem---Shipping Crate for an Electronic Box
269(5)
Low Values of the Frequency Ratio R
274(1)
Sample Problem---Shock Amplification for Low Frequency Ratio R
274(1)
Shock Isolators
275(2)
Sample Problem---Heat Developed in an Isolator
276(1)
Information Required for Shock Isolators
277(4)
Sample Problem---Selecting a Set of Shock Isolators
278(3)
Ringing Effects in Systems with Light Damping
281(1)
How Two-Degree-of-Freedom Systems Respond to Shock
282(2)
The Octave Rule for Shock
284(1)
Velocity Shock
285(1)
Sample Problem---Designing a Cabinet for Velocity Shock
285(1)
Nonlinear Velocity Shock
286(2)
Sample Problem---Cushioning Material for a Sensitive Electronic Box
288(1)
Shock Response Spectrum
288(3)
How Chassis and PCBs Respond to Shock
291(5)
Sample Problem---Shock Response Spectrum Analysis for Chassis and PCB
292(4)
How Pyrotechnic Shock Can Affect Electronic Components
296(4)
Sample Problem---Resonant Frequency of a Hybrid Die Bond Wire
298(2)
Design and Analysis of Electronic Boxes
300(30)
Introduction
300(1)
Different Types of Mounts
300(3)
Preliminary Dynamic Analysis
303(2)
Bolted Covers
305(3)
Coupled Modes
308(3)
Dynamic Loads in a Chassis
311(5)
Bending Stresses in the Chassis
316(2)
Buckling Stress Ratio for Bending
318(2)
Torsional Stresses in the Chassis
320(4)
Buckling Stress Ratio for Shear
324(1)
Margin of Safety for Buckling
325(1)
Center-of-Gravity Mount
326(2)
Simple Method for Obtaining Dynamic Forces and Stresses on a Chassis
328(2)
Effects of Manufcaturing Methods on the Reliability of Electronics
330(16)
Introduction
330(1)
Typical Tolerances in Electronic Components and Lead Wires
331(2)
Sample Problem---Effects of PCB Tolerances on Frequency and Fatigue Life
332(1)
Problems Associated with Tolerances on PCB Thickness
333(1)
Effects of Poor Bonding Methods on Structural Stiffness
334(1)
Soldering Small Axial Leaded Components on Through-Hole PCBs
335(1)
Areas Where Poor Manufacturing Methods Have Been Known to Cause Problems
336(2)
Avionic Integrity Program and Automotive Integrity Program (AVIP)
338(2)
The Basic Philosophy for Performing an AVIP Analysis
340(3)
Different Perspectives of Reliability
343(3)
Vibration Fixtures and Vibration Testing
346(33)
Vibration Simulation Equipment
346(1)
Mounting the Vibration Machine
347(1)
Vibration Test Fixtures
347(1)
Basic Fixture Design Considerations
348(2)
Effective Spring Rates for Bolts
350(2)
Bolt Preload Torque
352(1)
Sample Problem---Determining Desired Bolt Torque
353(1)
Rocking Modes and Overturning Moments
353(2)
Oil-Film Slider Tables
355(1)
Vibration Fixture Counterweights
356(1)
A Summary for Good Fixture Design
357(1)
Suspension Systems
357(1)
Mechanical Fuses
358(1)
Distinguishing Bending Modes from Rocking Modes
359(1)
Push-Bar Couplings
360(4)
Slider Plate Longitudinal Resonance
364(1)
Acceleration Force Capability of Shaker
365(1)
Positioning the Servo-Control Accelerometer
366(1)
More Accurate Method for Estimating the Transmissibility Q in Structures
367(2)
Sample Problem---Transmissibility Expected for a Plug-in PCB
368(1)
Vibration Testing Case Histories
369(1)
Cross-Coupling Effects in Vibration Test Fixtures
369(1)
Progressive Vibration Shear Failures in Bolted Structures
370(1)
Vibration Push-Bar Couplers with Bolts Loaded in Shear
371(2)
Bolting PCB Centers Together to Improve Their Vibration Fatigue Life
373(2)
Vibration Failures Caused by Careless Manufacturing Methods
375(1)
Alleged Vibration Failure that was Really Caused by Dropping a Large Chassis
376(1)
Methods for Increasing the Vibration and Shock Capability on Existing Systems
377(2)
Environmental Stress Screening for Electronic Equipment (ESSEE)
379(22)
Introduction
379(1)
Environmental Stress Screening Philosophy
379(2)
Screening Environments
381(2)
Things an Acceptable Screen Are Expected to Do
383(1)
Things an Acceptable Screen Are Not Expected to Do
383(1)
To Screen or Not to Screen, That is the Problem
384(1)
Preparations Prior to the Start of a Screening Program
384(3)
Combined Thermal Cycling, Random Vibration, and Electrical Operation
387(2)
Separate Thermal Cycling, Random Vibration, and Electrical Operation
389(1)
Importance of the Screening Environment Sequence
389(1)
How Damage Can Be Developed in a Thermal Cycling Screen
390(2)
Estimating the Amount of Fatigue Life Used Up in a Random Vibration Screen
392(9)
Sample Problem---Fatigue Life Used Up in Vibration and Thermal Cycling Screen
395(6)
Bibliography 401(4)
Index 405

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