Microelectromechanical Systems
by Lavan, D.; Spearing, M.; Venallatore, S.; Da Silva, M.Format: Hardcover
Pub. Date: 2008-03-17
Publisher(s): Cambridge Univ Pr
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Summary
This volume is the most recent in a popular series on the materials science of microelectromechanical system (MEMS) devices, first published in 1999. In the past nine years, many sophisticated devices have been designed and studied. Many aspects of MEMS materials behaviors have also been characterized.
Table of Contents
| A Review of Tension Test Methods for Thin Films | p. 3 |
| Reliability of MEMS Materials: Mechanical Characterization of Thin Films Using the Wafer Scale Bulge Test and Improved Microtensile Techniques | p. 15 |
| Fast Characterization of Silicon Membrane Structures by Laser-Doppler Vibrometry | p. 21 |
| MEMS Lubrication: An Atomistic Perspective of a Bound + Mobile Lubricant | p. 29 |
| Microstructural and Geometrical Factors Influencing the Mechanical Failure of Polysilicon for MEMS | p. 37 |
| Passive Devices for Determining Fracture Strength of MEMS Structural Materials | p. 47 |
| Effect of Surface Oxide Layer on Mechanical Properties of Single Crystalline Silicon | p. 53 |
| Indentation Characterization of Fracture Toughness and Interfacial Strength of PECVD Nitrides After Rapid Thermal Annealing | p. 59 |
| A Novel Micro Tensile Testing Instrument with Replaceable Testing Specimen by Parylene Passivation Technique | p. 65 |
| Mechanical Stress Sensors for Copper Damascene Interconnects | p. 73 |
| Elastic and Viscoelastic Characterization of Polydimethylsiloxane (PDMS) for Cell-Mechanics Applications | p. 81 |
| A Direct Method of Determining Complex Depth Profiles of Residual Stresses in Thin Films on a Nanoscale - Mechanics of Residually Stressed Systems | p. 87 |
| Modification of Conductivity and of Mechanical Properties of Electroactive Polymer (EAP) Thin Films by Titanium Ion Implantation | p. 93 |
| C-Axis Oriented ZnO Film by RF Sputtering and Its Integration with MEMS Processing | p. 99 |
| Optimization of the Geometry of the MEMS Electrothermal Actuator to Maximize In-Plane Tip Deflection | p. 105 |
| Aligned Low-Temperature Wafer Bonding for MEMS Manufacturing: Challenges and Promises | p. 111 |
| Compressive Stress Accumulation in Composite Nanoporous Gold and Silicone Bilayer Membranes: Underlying Mechanisms and Remedies | p. 117 |
| Variation in Dislocation Pattern Observed in SCS Films Fractured by Tensile Test: Effects of Film Thickness and Testing Temperature | p. 123 |
| Micro-Topography Enhances Directional Myogenic Differentiation of Skeletal Precursor Cells | p. 129 |
| RF MEMS Behavior, Surface Roughness and Asperity Contact | p. 135 |
| The Effect of Hydrophobic Patterning on Micromolding of Aqueous-Derived Silk Structures | p. 141 |
| Fabrication and Characterization of Normal and Shear Stresses Sensitive Tactile Sensors by Using Inclined Micro-Cantilevers Covered with Elastomer | p. 151 |
| Design and Fabrication of an Optical-MEMS Sensor | p. 157 |
| Relative Resistance Chemical Sensors Built on Microhotplate Platforms | p. 165 |
| Novel Differential Surface Stress Sensor for Detection of Chemical and Biological Species | p. 171 |
| Excimer Laser Induced Patterning of PSZT and PLZT Films | p. 179 |
| Optically Actuated Deformable Micro-Mirrors for Adaptive Optics | p. 185 |
| High Temperature Annealing Studies on the Piezoelectric Properties of Thin Aluminum Nitride Films | p. 191 |
| A Miniature Silicon Condenser Microphone Improved with a Flexure Hinge Diaphragm and a Large Back Volume | p. 197 |
| Comparison of 1D and 2D Theories of Thermoelastic Damping in Flexural Microresonators | p. 205 |
| Compliant MEMS Motion Characterization by Nanoindentation | p. 211 |
| Effects of Supercritical Carbon Dioxide on Adhesive Strength Between Micro-Sized Photoresist Patterns and Silicon Substrates | p. 217 |
| Protection Layer Influence on Capacitive Micromachined Ultrasonic Transducers Performance | p. 223 |
| Fabrication of C54-TiSi[subscript 2] Thin Films Using Cathodic Are Deposition and Rapid Thermal Annealing | p. 229 |
| New Experimental Approach for Measuring Electrical Contact Resistance with an Accurate Mechanical Actuation, Evaluation of the Performances of Gold Micro-Switches | p. 235 |
| A Comparative Study of the Strength of Si, SiN and SiC Used at Nanoscales | p. 241 |
| Compressive Magnetostriction of FeSm Alloy Film | p. 247 |
| Influence of Materials on the Performance Limits of Microactuators | p. 253 |
| Science and Technology of Piezoelectric/Diamond Hybrid Heterostructures for High Performance MEMS/NEMS Devices | p. 259 |
| Relationship Between Film Stress and Dislocation Microstructure Evolution in Thin Films | p. 265 |
| Systematic Characterization of DRIE-Based Fabrication Process of Silicon Microneedles | p. 271 |
| Novel Fabrication Process for the Integration of MEMS Devices with Thick Amorphous Soft Magnetic Field Concentrators | p. 277 |
| Analysis and Measurement of Forces in an Electrowetting-Driven Oscillator | p. 285 |
| Bottom-Up Fabrication of Individual SnO[subscript 2] Nanowires-Based Gas Sensors on Suspended Micromembranes | p. 291 |
| Nature-Inspired Microfluidic Manipulation Using Magnetic Actuators | p. 297 |
| MEMS-Based MHz Silicon Ultrasonic Nozzles for Production of Monodisperse Drops | p. 305 |
| Enabling the Desktop NanoFab with DPN Pen and Ink Delivery Systems | p. 313 |
| Author Index | p. 321 |
| Subject Index | p. 325 |
| Table of Contents provided by Blackwell. All Rights Reserved. |
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